September 2002 - "Top 10 Developments" in Ceramic Interconnect Technology Announced at IMAPS 2002 Washington, DC – The latest advances and challenges – “The Top Ten Developments in Ceramic Interconnect Technology” – were recognized at a recent press event hosted by the Ceramic Interconnect Initiative (CII) at IMAPS 2002, The 35th International Symposium on Microelectronics in Denver, Colorado. CAD-Design Software's "Hybrid Designer” has been nominated for the honor of being included in the Ceramic Interconnect Initiative's "Top 10 Ceramic Accomplishments for 2002".
July 2005 - CDS
RECEIVES PRESTIGIOUS AWARD FROM ADVANCED
PACKAGING MAGAZINE, which each
year awards the semiconductor packaging
industry’s most innovative companies
with a prestigious recognition of
excellence for electronic packaging
applications. CAD Design Software's
Bond Wire Optimizer/3D Design won in the
CAD Package Design Software & Equipment
category
