Fremont, California, February 01, 2016
Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that the company recently partnered with CAD Design Software.
The Hesse Mechatronics Utility Module creates an XML data file that contains wire bond information of polylines in a DXF/DWG file. This XML data file can be used with Hesse Mechatronics wire bonding machines that accept XML data format. This can be done on the Hesse Mechatronics Wire Bonders BJ820, BJ935 and BJ939.
•
Multiple bond wire groups can
be set with unique References.
•
Sequence numbers and
direction arrows will be visible in
the drawing.
•
Create individual bond
wire reference blocks.
•
Update existing blocked
entities such as the dies or chips
with Reference points that will be
included in the XML output.
•
Assign a name for the
Bond Wire Reference (BDS) for
selected wires.
•
Assign the Reference a
Sequence Number (BDR), which
controls the order in which each
will appear in the exported XML
file.
•
Assign a parent name
(DEPENDON) to use as a reference
system.
•
Set a symbol text
(REFP1, REFP2) to be used as a first
and second reference point.
•
Add direction arrows
and sequence numbers to the drawing
and set size of text and arrow size.
•
An array of wire bond
data can be exported when an array
of identical parts is being wire
bonded. The following parameters are
available:
o
Set a Pitch of the
array in the X (horizontal)
dimension.
o
Set a Pitch of the
array in the Y (vertical) dimension.
o
Set a Quantity of
arrayed parts counted in the
vertical dimension.
o
Set a Quantity of
arrayed parts counted in the
horizontal dimension.
See CDS Product Page: Bond Wire Export Module