CDS announces the release of Version 7.5.
CAD Design Software releases the latest version of their leading-edge circuit layout tools for the IC packaging, RF/Microwave, Hybrid/MCM, and PCB layout industries, incorporating advanced interoperability capabilities.
December 4, 2006, San Jose, Calif.—CAD Design Software announces the release of the latest version of their advanced layout tools. Version 7.5 is the culmination of extensive collaborative relationships with many industry leaders in the U.S., Japan, and Asia in the Semiconductor Packaging, Hybrid/MCM, IC Test, and RF/Microwave fields.
“Through working closely with top industry leaders, we’ve been able to rapidly implement new layout solutions for emerging technologies as well as created new output and routing tools for IC packaging, IC Test, RF, and MCM layout.
More robust, sophisticated algorithms and new data optimization result in faster processing, and new customer-requested functions improve overall time-to-market, and verifiably improve yields.
CAD Design Software‘s Version 7.5 is unsurpassed in features, functions, and most of all, flexibility. CAD Design Software leads the EDA industry with the most rapid development and implementation of new tools for emerging high-end new technologies for its customers. This has resulted in many industry firsts, including Stacked Die, 3D design, automated IC package routing, co-development and design-for-manufacture (DFM) platforms.
About CAD Design Software:
CAD Design Software provides complete 3D Electronic Design Automation solutions for semiconductor packaging and PCB designs disciplines using Electronics Packaging Designer (EPD) software suites for applications such as BGA, mBGA, Hybrid/MCM, Lead Frame, Stacked Die, IC Test, RF/Microwave, Flex and other design technologies.
