The RF Technology is set of unique software tools for the graphical and electrical requirements of RF / Microwave circuits to dramatically reduce layout time. The RF environment features a comprehensive library of parametrically controlled RF elements and provides the electrical intelligence to all custom element and components.
Key Features Include:
- Parametric creation of embedded elements - Dividers, couplers, spiral inductors, radial stubs, etc.
- Support for embedded
components and circuits
inside blocks (cells).
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Concurrent Routing/Parasitic Extraction (RLC) while routing will display calculations for: Resistance (R), Inductance (L), Capacitance (C)
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Any angle, online-DRC, shape-based manual, interactive, and automatic routing.
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Advanced Route Module is included in the Master RF and Master PCB Suites.
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RF Vias are parametrically created with additional shielding vias around the signal via.
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Length tuning and match tuning of nets using parametric tuning functions.
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Support for true RF miters and fillets with true arcs.
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Creates coplanar ground shields with coplanar vias automatically.
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Automatic placement of plane ties on SMT components, on all levels and nets with automatic tie segment / via reduction or deletion based on DRC results.
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Boundary planes with progressively filleted corners and variable individual gap control on any entity.
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Split plane edges are automatically generated from simple to draw dividers.
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Powerful region modelers for solid, cross-hatched, negative image, co-planar, and boundary based planes.
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Via peppering creates via arrays connecting same plane nets on multiple levels and automatically removes vias that would cause DRC errors.
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Automatic generation of assembly and fabrication drawings.
3D Capabilities available on RF Technology *
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3D visualization of design created as true 3D model for accurate data output to mechanical and analysis systems.
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Subtract Vias and Holes from Substrate, Pads and Traces.
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Create Cylindrical Holes and specify Hole Wall Thickness.
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Industry standard outputs (ACIS, IGES, STEP)
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*Read more about 3D Technology