This module combines multiple packages or circuit boards into the same database to allow full system continuity and design rule checks, and allows the stacked packages to be separated for fabrication. 

The Most Advanced in Package on Package (PoP) Layout Design, Created For and Used by the World's Leading Semiconductor Manufacturers, with a wide range of tools.

Package on Package (PoP) was developed in conjunction with the world's largest semiconductor company for complex stacked die and Package on Package and is used by top semiconductor companies worldwide.

Two separate packages or circuit boards can be combined in the same database to allow full system continuity and design rule checks. The system automatically detects the connection points from one package or circuit board to another, allowing for optimization of ratline connections, pin assignments on interface devices (such as the ballgrid array), and manufacturing rules. 

Dies can be captured from GDSII files, drawings or data files. Wirebond fanout design programs support multiple dies simultaneously, including direct die to die connections and the sharing of bondfingers by different dies in the stack. The software can also be used to design a substrate simultaneously for multiple products. Alternate dies may be simultaneously designed into the substrate to support multiple suppliers of similar but different parts for the same product. Many of the tools in this suite have been developed in direct response to the needs of the world’s largest silicon and packaging companies.

1. Infinite complex variations of bondwire fanout designs

2. Support for any number of power rings and bond finger rows

3. Individual bondfinger controls for size, spacing, angles, pullback, etc.

4. All manufacturing rules are verified as the bondwire fanout is being designed

5. Support for multiple die sourcing through advanced configuration options

6. Automatic offset of bondwires along bonding finger axis to support bond finger sharing
   

Features Include:

• Infinite complex variations of bondwire fanout designs

• Support for any number of power rings and bond finger rows

• Advanced Configuration utilities allow complex bonding patterns

• Individual bondfinger controls for size, spacing, angles, pullback, etc.

• All manufacturing rules are verified as the bondwire fanout is being designed

• Support for multiple die sourcing through advanced configuration options

• Easy viewing of any combination of dies during the wirebond creation process

• Support for pad sharing by reading a netlist

• Bondwire length shown in 2D and 3D