Press Release – New Software Version

CDS announces the release of Version 7.6.

CAD Design Software releases the latest version of their leading-edge circuit layout tools for the IC packaging, RF/Microwave, Hybrid/MCM, and PCB layout industries, incorporating advanced interoperability capabilities.

April 30, 2007, San Jose, Calif.—CAD Design Software announces the release of the latest version of their advanced layout tools. Version 7.6 adds uni-code functionality to the many features introduced in Version 7.5 which was released in December of 2006

CAD Design Software‘s Version 7.6 is unsurpassed in features, functions, and most of all, flexibility. CAD Design Software leads the EDA industry with the most rapid development and implementation of new tools for emerging high-end new technologies for its customers. This has resulted in many industry firsts, including Stacked Die, 3D design, automated IC package routing, co-development and design-for-manufacture (DFM) platforms.

About CAD Design Software:
CAD Design Software provides complete 3D Electronic Design Automation solutions for semiconductor packaging and PCB designs disciplines using Electronics Packaging Designer (EPD) software suites for applications such as BGA, mBGA, Hybrid/MCM, Lead Frame, Stacked Die, IC Test, RF/Microwave, Flex and other design technologies.