March 5, 2009,
DuPont Microcircuit Materials (MCM), part of DuPont Electronic
Technologies, and CAD Design Software have announced the integration
of DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC)
materials and manufacturing processes into CAD Design Software’s
Electronic Design Automation (EDA) design tools for Ceramic (Hybrid/MCM
– LTCC) circuit design. By incorporating the widely used DuPont™
Green Tape™ 951 and 943 systems, CAD Design Software’s Ceramic
Design tool automates DuPont’s recommended LTCC processes, and
significantly improves cycle time for advanced circuit design.
“CAD Design Software’s EDA tools have some unique properties in the
way they have been customized for use with DuPont™ Green Tape™ LTCC
– design cycle time can now be reduced by days,” said John D.
Voultos, global business manager - LTCC, DuPont Microcircuit
Materials. “We expect this to be well-received by a broad range of
designers focused on accelerating the development of advanced
circuits for military, aerospace, and automotive industries, where
Green Tape™ is most often utilized for its consistent high quality
and absolute reliability.”
DuPont™ Green Tape™ LTCC is a technology option for designers that
delivers high density, high reliability, excellent performance, and
low cost interconnect packages and substrates. DuPont™ Green Tape™
systems are widely recognized as a standard in the ceramics industry
because they meet increasing demands for electronics functioning in
extreme heat and other harsh environments. Green Tape™ 951 and 943
systems each have their own recommended conductive and resistive
pastes for the best manufacturing process results.
“Through working closely with DuPont, we have been able to
incorporate new functionality and materials handling capabilities
that allow our customers to quickly implement Green Tape™ materials
for leading-edge ceramic applications. DuPont MCM is a market leader
and we are happy that we can provide DuPont materials capabilities
for our many ceramic customers.
The ability to select materials from CAD Design Software’s Materials
Library allows the user to setup custom technology parameters to
begin a ceramic design or choose one from the list of preset
technology files. The preset technology files have all of the DuPont
recommended minimum entity widths and spacings incorporated for
efficient design and manufacturing flow.
CAD Design Software has incorporated many CAM tools for the ease of
processing a ceramic design, such as nibbler data for removing
cavity material in bulk or in steps, and control of the Gerber, hole
and punch data for correct output to manufacturing.
CAD Design Software provides complete 3D Electronic
Design Automation solutions for semiconductor packaging and PCB
designs disciplines using Electronics Packaging Designer (EPD)
software suites for applications such as BGA, uBGA, Ceramic (Hybrid/MCM,
LTCC), Lead Frame, Stacked Die, IC Test, RF/Microwave, Flex and
other design technologies. For more information on CAD Design
Software, call 408.436.1340, visit our web site at http://www.cad-design.com,
or e-mail to info@cad-design.com.
DuPont Microcircuit Materials has over 40 years of
experience in the development, manufacture, sale, and support of
specialized thick film compositions for a wide variety of electronic
applications in the automotive, display, photovoltaic, biomedical,
industrial, military, and telecommunications markets. For more
information on DuPont Microcircuit Materials, please visit
http://mcm.dupont.com.
Microcircuit Materials is part of DuPont Electronic Technologies, a
leading supplier of electronic materials, including materials for
the fabrication and packaging of semiconductors, materials for
hybrid, rigid and flexible circuits, and materials for advanced
displays.
DuPont is a science-based products and services company. Founded in
1802, DuPont puts science to work by creating sustainable solutions
essential to a better, safer, healthier life for people everywhere.
Operating in more than 70 countries, DuPont offers a wide range of
innovative products and services for markets including agriculture
and food; building and construction; communications; and
transportation.