The Die Bump / Flip Chip Technology automates the process of creating redistribution routing and bump artwork to convert a standard die to a flipchip die. The redistribution layer can be created easily and quickly directly on the IC through the use of our automated bump creation and Interactive Autorouting utilities. 

Key Features Include:

• GDSII stream file reader imports graphics from large dies and extracts relevant layers and entities by viewing a preview of the die's structure

• BallGrid command makes patterns with a configurable number of levels and shapes for use as bumps

• Automatic or interactive net list generation by 3 different methods

• Autorouter designed for dense BGA routing with just enough clearance

  • See the Inter-Active Autorouter Module

• Complete netlist verification and DRC

• Wafer Array command panelizes the design in perfect alignment with the original silicon image 

• Easy die creation tools can create dies from .LIQ .DIE .DWG GDS Digital scans (with distortion compensation) and manual data entry into parametric dialog box

• Automatic orientation of die for redistribution on silicon design or for later substrate routing.

• Routing using automatic length tuning and matching.

• Differential pairs are interactively routed.
  

• The DBD Technology is included with Suites:
• EPD for Windows
  Design Suites
• EPD Professional